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Patent Issued for Semiconductor Device and Method of Depositing Encapsulant along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP…

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by November 22, 2016 General

Patent Issued for Semiconductor Device and Method of Depositing Encapsulant along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP (USPTO 9496195)By a News Reporter-Staff News Editor at China Weekly News — From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Lin, Yaojian (Singapore, SG); Wirtz, Heinz-Peter (Dottingen, CH); Yoon, Seung Wook (Singapore, SG); Marimuthu, Pandi C. (Sinagpore, SG), filed on March 15, 2013, was published online on November 15, 2016.The patent’s assignee for patent number 9496195 is STATS ChipPAC Pte. Ltd. (Singapore, SG).News editors obtained the following quote from the background information supplied by the inventors: “Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integrated semiconductor devices include microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells, and digital micro-mirror devices (DMDs).“Semiconductor devices perform a wide range of functions such as signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays. Semiconductor devices are found in the fields of entertainment, communications, power conversion, networks, computers, and consumer products. Semiconductor devices are also found in military applications, aviation, automotive, industrial controllers, and office equipment.“Semiconductor devices exploit the electrical properties of semiconductor materials. The structure of semiconductor material allows its electrical conductivity to be manipulated by the application of an electric field or base current or through the process of doping. Doping introduces impurities into the semiconductor material to manipulate and control the conductivity of the semiconductor device.“A semiconductor device contains active and passive electrical structures. Active structures, including bipolar and field effect transistors, control the flow of electrical current. By varying levels of doping and application of an electric field or base current, the transistor either promotes or restricts the flow of electrical current. Passive structures, including resistors, capacitors, and inductors, create a relationship between voltage and current necessary to perform a variety of electrical functions. The passive and active structures are electrically connected to form circuits, which enable the semiconductor device to perform high-speed operations and other useful functions.“Semiconductor devices are generally manufactured using two complex manufacturing processes, i.e., front-end manufacturing, and back-end manufacturing, each involving potentially hundreds of steps. Front-end manufacturing involves the formation of a plurality of die on the surface of a semiconductor wafer. Each semiconductor die is typically identical and contains circuits formed by electrically connecting active and passive components. Back-end manufacturing involves singulating individual semiconductor die from the finished wafer and packaging the die to provide structural support and environmental isolation. The term ‘semiconductor die’ as used herein refers to both the singular and plural form of the words, and accordingly, can refer to both a single semiconductor device and multiple semiconductor devices.“One goal of semiconductor manufacturing is to produce smaller semiconductor devices. Smaller devices typically consume less power, have higher performance, and can be produced more efficiently. In addition, smaller semiconductor devices have a smaller footprint, which is desirable for smaller end products. A smaller semiconductor die size can be achieved by improvements in the front-end process resulting in semiconductor die with smaller, higher density active and passive components. Back-end processes may result in semiconductor device packages with a smaller footprint by improvements in electrical interconnection and packaging materials.“Semiconductor die are typically enclosed within a semiconductor package for electrical interconnect, structural support, and environmental protection of the die. The semiconductor can be subject to damage or degradation if a portion of the semiconductor die is exposed to external elements, particularly when surface mounting the die. For example, the semiconductor die can be damaged or degraded during handling and exposure to light.”As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors’ summary information for this patent: “A need exists to protect the semiconductor die within a semiconductor package. Accordingly, in one embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a semiconductor wafer including a plurality of semiconductor die, forming an insulating layer over the semiconductor wafer, removing a portion of the insulating layer to expose a portion of an active surface of the semiconductor die, singulating the semiconductor wafer to separate the semiconductor die, and depositing an encapsulant over the semiconductor die to cover a side of the semiconductor die and the exposed portion of the active surface of the semiconductor die.“In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a semiconductor die, forming an insulating layer over the semiconductor die, removing a portion of the insulating layer to expose a portion of a surface of the semiconductor die, and depositing an encapsulant over the semiconductor die to cover a side of the semiconductor die and the exposed portion of the active surface of the semiconductor die.“In another embodiment, the present invention is a semiconductor device comprising a semiconductor die and insulating layer formed over the semiconductor die with a portion of a surface of the semiconductor die devoid of the insulating layer. An encapsulant is deposited over the semiconductor die to cover a side of the semiconductor die and the portion of the surface of the semiconductor die devoid of the insulating layer.“In another embodiment, the present invention is a semiconductor device comprising a semiconductor die and insulating layer formed over the semiconductor die with a portion of a surface of the semiconductor die devoid of the insulating layer. An encapsulant is deposited over the semiconductor die to cover the portion of the surface of the semiconductor die devoid of the insulating layer.“In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a substrate, mounting a semiconductor die to the substrate, depositing a mold underfill material over a side surface of the semiconductor die and an exposed surface of the semiconductor die, and depositing an encapsulant over the mold underfill material.”For additional information on this patent, see: Lin, Yaojian; Wirtz, Heinz-Peter; Yoon, Seung Wook; Marimuthu, Pandi C.. Semiconductor Device and Method of Depositing Encapsulant along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP. U.S. Patent Number 9496195, filed March 15, 2013, and published online on November 15, 2016. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9496195.PN.&OS=PN/9496195RS=PN/9496195Keywords for this news article include: Asia, Singapore, Electronics, Semiconductor, STATS ChipPAC Pte. Ltd..Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2016, NewsRx LLC(c) 2016 NewsRx LLC, source Geographic Newsletters

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